June Kit Class 5 — Egg Drop Challenge: Engineering Under Pressure

Service Description

The classic engineering challenge — redesigned for virtual STEM! Students engineer a protective capsule for a raw egg using everyday materials: bubble wrap, foam, plastic bags, rubber bands, cardboard, and tape. Then they drop it. This lesson explores impact force, impulse, momentum, material properties, and the engineering design process. Students analyze why some designs survived and others didn't. Kit required: EdTech Academy Egg Drop Challenge Kit (NEW — $24.99). Kit includes bubble wrap, foam sheet, plastic zip bags, rubber bands, cardboard strips, and tape — everything needed for 2 full build attempts. Add the kit to your order for the combined class + kit price of $40. Grades K–8 · 60 minutes · Live virtual · Wednesdays & Thursdays June 18-19 & 25-26 Two time slots: 4:30–5:30pm and 6:00–7:00pm CST